Shenzhen Hansome Technology Co., Ltd.
Shenzhen Hansome Technology Co., Ltd.
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High-precision CCD colour alignment system for PCB handling equipment
Introduction
BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of package chip.BGA is based on the ball grid array structure to enhance the characteristics of digital equipment to reduce the size of the product. BGA is based on the ball grid array structure to enhance the characteristics of digital devices and reduce the size of the product. All the digital devices based on this packaging technology have the same characteristics, that is, small size, strong features, low cost, powerful functions, BGA rework station is used to repair the BGA chip equipment.
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging
COMPANY PROFILE
Shenzhen Hansome Technology Co.,Ltd(HSTECH)is a professional professional SMT board handlingequipment(Loader,Unloader, Buffer, Conveyor,etc)manufacturer, We are a high-tech enterprise with independent intellectual propertyrights,the company is mainly engaged in the research and development, productionand sales of sMT/THT production line board handling equipment.We have professional technicians & sales,relies on high-tech and tries our best tosupply high efficient and reliable board handling to our customers. At the same time,our experienced engineering team always grasps smart factory's developing directionupdates the products and technical according to the market demand, pursuit to makemore automation and cost-effective product all the time, we also do the OEM basedon different needs of our customer.