Shenzhen Hansome Technology Co., Ltd.

Shenzhen Hansome Technology Co., Ltd.

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3 Heating Rework Station Zones Manual BGA Touch Screen with & CE for Electronic Assembly

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Shenzhen Hansome Technology Co., Ltd.
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrRudi Jin
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3 Heating Rework Station Zones Manual BGA Touch Screen with & CE for Electronic Assembly

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Brand Name :HSTECH
Model Number :HS-520
Certification :CE
Place of Origin :China
MOQ :1 set
Price :Negotiable
Payment Terms :T/T, Western Union, MoneyGram
Supply Ability :100 sets per month
Delivery Time :7~9 work days
Packaging Details :Wooden package
Product Name :BGA Rework Station
Warranty :1 Year
Control :Touch Screen
Thickness :0.3 - 5mm
Application :Electronic Assembly
Control System :PLC
Power Supply :AC220V
Working Environment :30KG
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3 Heating Zones Manual BGA Touch Screen Rework Station with & CE

Introduction:

A BGA Rework Station is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA chips, soldering new components, and performing maintenance on PCBs.

Features:

1.Repair Success Rate:More Than 99%

2.Using The Industrial Touch Screen

3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)

4.With CE Certification.

​Specification:

Manual BGA Rework Station Model:HS-520
Power Supply AC 220V±10% 50/60Hz
Total power 3800W
Overall dimension L460mm*W480mm*H500mm
PCB size Max 300mm*280mm Min 10mm*10mm
BGA size Max 60mm*60mm Min 1mm*1mm
PCB thickness 0.3-5mm
Weight of machine 20KG
Warranty 3 years (1st year is free)
Usage Repair chips / phone motherboard etc

Applications

  1. Repair and Maintenance:

    • Used to repair faulty BGAs on PCBs in various electronic devices, including smartphones, computers, and industrial equipment.
  2. Prototyping:

    • Essential for prototype development in electronics, where components may need frequent replacement or adjustment.
  3. Rework in Production:

    • Employed in manufacturing environments where defects occur during the production process, allowing for quick turnaround times on repairs.
  4. Upgrading Components:

    • Facilitates the upgrading of existing systems by replacing old BGAs with newer, more advanced components.

Benefits

  • Efficiency: Speeds up the rework process, reducing downtime and increasing productivity in repair and manufacturing environments.
  • Precision: Allows for accurate placement and soldering of components, ensuring reliable connections and minimizing the risk of defects.
  • Cost-Effective: Extends the lifespan of PCBs by enabling repairs rather than complete replacements, saving costs on materials and labor.
  • Versatility: Suitable for a wide range of BGA sizes and types, making it a valuable tool in various electronic applications.

3 Heating Rework Station Zones Manual BGA Touch Screen with & CE for Electronic Assembly

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