Shenzhen Hansome Technology Co., Ltd.
Shenzhen Hansome Technology Co., Ltd.
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Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station
Specification
| BGA Rework Station | Model:HS-620 |
| Power Supply | AC 220V±10% 50/60Hz |
| Total power | 3500W |
| Heater power | Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W |
| Electric material | Driving motor+PLC smart temp.controller+color touch screen |
| Temperature | control independent temp.controller,the precision can reach ±1℃ |
| Temperature Interface | 1pcs |
| Locating way | V shape slot,PCB support jigs can adjust,laser light do fast centering and position |
| Overall dimension | L650mm*W630mm*H850mm |
| PCB size | Max 450mm*390mm Min 10mm*10mm |
| BGA size | Max 80mm*80mm Min 1mm*1mm |
| Weight of machine | 60KG |
| Usage Repair | chips / phone motherboard etc |
Features
1.Automatic&Manual operation system.
2. 5 million CCD camera optical alignment system mount precision:±0.01mm.
3.MCGS touch screen control.
4.Laser position.
5.Repair success rate 99.99%.
Advantages
Upper and lower heaters
1.integrated design of hot air heating head and mounting head.
2.lt has three independent heating zoneswith fast heating and a large temperature differencebetween the repair platform and the nearby. BGAwhich does not affect the surrounding BGA during heating.
Bottom heater
1.Use ceramic heating plate.
2. Make the heating of the PCB board more unifo.
Infrared heating area control switch
Control the left and right heatingplates to minimize poweroutput and save energy
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