Shenzhen Hansome Technology Co., Ltd.
Shenzhen Hansome Technology Co., Ltd.
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3 Heating Zones Manual BGA Rework Station with Industrial Touch Screen & CE
Specification
| Manual BGA Rework Station | Model:HS-520 |
| Power Supply | AC 220V±10% 50/60Hz |
| Total power | 3800W |
| Overall dimension | L460mm*W480mm*H500mm |
| PCB size | Max 300mm*280mm Min 10mm*10mm |
| BGA size | Max 60mm*60mm Min 1mm*1mm |
| PCB thickness | 0.3-5mm |
| Weight of machine | 20KG |
| Warranty | 3 years (1st year is free) |
| Usage Repair | chips / phone motherboard etc |
Features
1.Repair Success Rate:More Than 99%. bga rework station.
2.Using The Industrial Touch Screen. soldering and desoldering station.
3.Independent 3 Heating Zones, Hot Air Heating / Infrared Preheat. ( accuracy ± 3℃).
4.With CE Certification, double over temperature protection function.
5.Can solder, desolder, mount, pick and replace chip.
6.Hot air nozzle can be rotated in 360 degree.
7.Eight segments rising temperature/constant time/ temperature rising slope, it can save hundreds of groups temperature curve. bga reballing kit
8.It adopting high accuracy K-type thermocouple close-loop control.
9.The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.
10.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc.
About Packaging
