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Air Cooled 3W UV Laser Marking System with Min Character 0.15mm
Specification
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About Packaging
SMT production line equipment
1. Universal SMT machine: Using the program edited by the device to mount components onto designated parts positions, it can mount SOP 28 pin or more (including components that can be mounted by high-speed machines) roll, disc, or tubular packaging components. Its characteristics are high precision and diversity, but its installation speed is inferior to high-speed machines.
2. Reflow soldering: Use SMT solder paste or red glue to set an appropriate temperature curve to complete the soldering action between the solder paste and the part.
3. Unloader: The board is loaded into the magazine through a transfer track.