Shenzhen Hansome Technology Co., Ltd.
Shenzhen Hansome Technology Co., Ltd.
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5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Repair steps
1.Separate the BGA chip from mother board –we called desoldering.
2.Clean Pad.
3.Reballing or replace a new BGA chip directly.
4.Alignment/Positioning – Depend on experience ,silk frame ,optical camera.
5. replace a new BGA chip - we called Soldering hot air smd rework station iphone ic replace machine.
About Packaging
